Lead Free Eproxy & Tacky Soldering Fluxes (TSF)
Lead-Free Epoxy and Tacky Soldering Fluxes (TSF) - rework and attachment of Lead-Free BGA, CSP, and OGA required new flux systems able to sustain higher thermal requirements without charring or rendering flux residue removal difficult.
Epoxy Flux
Epoxy Flux | |
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Formula | SE-CURE 9611 |
Product Characteristics | SE-CURE 9600 series epoxy fluxes are designed for flip chip soldering and
underfill applications to printed wiring assemblies.
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Typical Application Methods |
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Viscosity (Typical) | 5.1 kcps at 5rpm (Brookfield at 25°C TD-spindle) |
Tack (grams-force) | >100 |
Compliant Specification | IPC ANSI/J-STD-004 Flux designator REH1 |
Residue Removal Method | Removal of residues is not required but can be done with solvent systems (aliphatic ketones) |
Tacky Soldering Fluxes
No-Clean | Water-Soluble | |
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Formula | TSF-6502 | TSF6805L |
Product Characteristics | Low viscosity. Ideal for sphere and pin attachment (BGA, CSP, PGA), flip chip mounting (FCAP and FCOB) and no-clean rework operations. High activity no-clean soldering for more difficult metallization. Compatible with air or nitrogen reflow. Residue interact well with many capillary underfill materials. | For high speed dot dispensing, BGA/PGA or rework application. Stencil print processing window. Solid solder deposit (SSD) or precision pad technology (PPT) boards surfaces. |
Typical Application Methods |
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Viscosity (Typical) | 110 poise at 10rpm (Malcom at 25°C) | 125 poise at 10rpm (Malcom at 25°C) |
Tack (grams-force) | 115 | 96 |
Compliant Specification | IPC ANSI/J-STD-004 Flux designator R0L1 |
IPC ANSI/J-STD-004 Flux designator 0RH0 |
Residue Removal Method | Removal of residues is not required but can be done with Kester's #5768 Bio-Kleen saponifier in a 10 to 12% solution with 60°C-71°C (140°F-160°F) de-ionized automated water wash system. | Remove residue by using de-ionized water in automated cleaning equipment with water temperature at 49°C-65°C(120°F-150°F) |