Lead Free Eproxy & Tacky Soldering Fluxes (TSF)

Lead-Free Epoxy and Tacky Soldering Fluxes (TSF) - rework and attachment of Lead-Free BGA, CSP, and OGA required new flux systems able to sustain higher thermal requirements without charring or rendering flux residue removal difficult.


Epoxy Flux
Epoxy Flux
Formula SE-CURE 9611
Product Characteristics SE-CURE 9600 series epoxy fluxes are designed for flip chip soldering and underfill applications to printed wiring assemblies.
  • Ideal for FC-BGA/-PGA, DCA, COB,FC-CSP DIE attachment
  • Residue polymerize with underfill for highest level of reliability
  • Air or nitrogen reflowable
  • High activity no-clean soldering/underfill process
Typical Application Methods
  • Slide Fluxer
  • Rotating drum/doctor blade applicator
  • Thin film applicator
Viscosity (Typical) 5.1 kcps at 5rpm
(Brookfield at 25°C TD-spindle)
Tack (grams-force) >100
Compliant Specification IPC ANSI/J-STD-004
Flux designator REH1
Residue Removal Method Removal of residues is not required but can be done with solvent systems (aliphatic ketones)

Tacky Soldering Fluxes
No-Clean Water-Soluble
Formula TSF-6502 TSF6805L
Product Characteristics Low viscosity. Ideal for sphere and pin attachment (BGA, CSP, PGA), flip chip mounting (FCAP and FCOB) and no-clean rework operations. High activity no-clean soldering for more difficult metallization. Compatible with air or nitrogen reflow. Residue interact well with many capillary underfill materials. For high speed dot dispensing, BGA/PGA or rework application. Stencil print processing window. Solid solder deposit (SSD) or precision pad technology (PPT) boards surfaces.
Typical Application Methods
  • Stencil or Screen Printing
  • Pin Transfer
  • Rotating Drum/Doctor Blade Applicator
  • Thick Film Applicator
  • Stencil or Screen Printing
  • Pin Transfer
  • Dot Dispensing
  • Syringe Applications
Viscosity (Typical) 110 poise at 10rpm (Malcom at 25°C) 125 poise at 10rpm (Malcom at 25°C)
Tack (grams-force) 115 96
Compliant Specification IPC ANSI/J-STD-004
Flux designator R0L1
IPC ANSI/J-STD-004
Flux designator 0RH0
Residue Removal Method Removal of residues is not required but can be done with Kester's #5768 Bio-Kleen saponifier in a 10 to 12% solution with 60°C-71°C (140°F-160°F) de-ionized automated water wash system. Remove residue by using de-ionized water in automated cleaning equipment with water temperature at 49°C-65°C(120°F-150°F)