Solder Paste
Solder Paste Formulas for Surface Mount and General Electronic AssembliesAll Kester solder paste formulas are manufactured using the highest quality raw materials available. Kester's worldwide research facilities work together to design solder paste formulas which bring the latest technological deve1opment to electronic manufacturers around the globe. Standard operating procedures are used throughout Kester's worldwide manufacturing Facilities in the production of oxide free solder powders and paste fluxes. A high level of quality and consistency is assured through process control techniques. All product reliability and chemical property testing is conducted by Kester's own certified Chemical Analytical Laboratories.
The solder paste formu1as listed represent the current product recommendations at the time of printing. Please contact Kester's Technical Service Department for a specific product recommendation for your application.
Characteristics | Product Characteristics | Residue removal Method | Expected Tack Life | Atmosphere Required for Reflow | Compliant Specifications |
---|---|---|---|---|---|
R596 | Standard water soluble formula for all reflow applications. It is resistant to high temperature and humidity | Use de-ionized or soft tap water at 130-150°F | 8+ hours | Air or Nitrogen | ANSI/J-STD-004 |
R596-3 | High activity formula for advanced microelectrons applications. | Use de-ionized or soft tap water at 130-150°F | 6+ hours | Air or Nitrogen | ANSI/J-STD-004 |
Characteristics | Product Characteristics | Expected Tack Life | Atmosphere Required for Reflow | Compliant Specifications |
---|---|---|---|---|
R244 | Full residue, standard no-clean paste for all reflow
applications. R244 is an industry standard formula that combines many good properties into a user friendly product |
8+ hours | Air or Nitrogen | Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005 |
R244C | Full residue, more active and tackier version of R244. Designed for fast speed printing applications. | 8+ hours | Air or Nitrogen | Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005 |
R253 | Full residue, fast wetting paste for applications where post soldering residues need to be compatible with In Circuit Testing. | 8+ hours | Air or Nitrogen | Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005 |
R253-5 | Full residue, more active version of R253. Designed for fast wetting applications and better compatibility with In Circuit Testing. | 8+ hours | Air or Nitrogen | Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005 |
R289TM | Full residue, fast wetting paste designed to meet the needs of high reliability | 8+ hours | Air or Nitrogen | Bellcore Issue 3 TR-NWT-000078 ANSI/J-STD-005 |
Characteristics | Product Characteristics | Expected Tack Life | Compliant Specifications |
---|---|---|---|
R229-25 | Good activity formula for good solderability. Designed to have thixotopic property that would suit fine pitch type of mounting. | 8+ hours | IPC-SP-818 |
R229 | Design with thixotopic characteristic suitable for syringe dispensing, wash screen printing and actual stenciling. High solubility of residue in solvent. | 6+ hours | IPC-SP-818 |