Tacky Soldering Fluxes

Kester's Tacky Soldering Fluxes (TSF) are used as a tacky agent and flux vehicle for soldering components to a solid solder deposit (SSD) board surface. They can be used in BGA/PGA ball or pin attachment or rework processes. Kester's TSF products can also function as a soldering flux in flip chip applications or for rework applications on all PCB packages. TSF's are commonly processed using pin transfer, dot dispensing, and/or syringe dispensing methods; but they can also be screen or stencil printed.


Characteristics 6502 6522
Flux Type No-Clean No-Clean
Product Characteristics Formulated for chip scale packaging and production. It combines many good properties into a user friendly product. Formulated for chip scale packaging and production. More active for fast wetting applications.
Compliant Specifications Bellcore Compliant ANSI/J-STD-004 Bellcore Compliant ANSI/J-STD-004
Residue Removal Methods Removal of residues is not required*, but can be done with a solvent or Kester's #5768 saponifier in a 10-12% solution with 140-160°F de-ionized water. Removal of residues is not required*, but can be done with a solvent or Kester's #5768 saponifier in a 10-12% solution with 140-160°F de-ionized water.
Atmosphere Required for Reflow Air or Nitrogen Air or Nitrogen

Rework and repair operations should be qualified by user as no-clean applications. TSF residues may need to be removed depending on the application.