Water Soluble Liquid Fluxes


Alcohol Based
Characteristics 2331- ZX 2235 2224 - 25 2222
Flux Type Neutral pH Organic Water Soluble Organic Water Soluble Organic Water Soluble Highly Activated Organic Water Soluble
Percent Solids 33 11 24 17
Specific Gravity 0.899 ± 0.005 0.856 ±0.005 0.882 ±0.005 0.950 ±0.010
Product Characteristics Original pH neutral organic flux for automated wave and drag soldering processes Very active flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads Highly active organic flux designed for automated wave soldering applications. Higher percent solids than 2235 for greater heat stability Kester's highest activity, organic acid flux that can be applied by foam or spray methods
Compliant Specifications ANSI/J-STD-004 ANSI/J-STD-004 ANSI/J-STD-004 ANSI/J-STD-004
Residue Removal Method Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150°F Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150°F Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150°F Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150°F
Thinner 4662 4662 4662 4664

VOC - Free
Characteristics 2222-VF HF-1189A
Flux Type VOC-Free Organic Water soluble VOC free Organic Water soluble
Percent Solids 17 40
Specific Gravity 1.043±0.010 1.20±0.010
Product Characteristics VOC-free, water soluble flux for difficult to solder assemblies which can be applied by spray, dip or foam techniques VOC-free, halide free citric acid based, water based flux developed by Hughes
Compliant Specifications ANSI/J-STD-004 ANSI/J-STD-004
Residue Removal Method Residue removal is required. Use soft or de-ionized water at temperatures of 120 - 150°F Residue removal is required. Use soft or de-ionized water at temperatures of 120 -150°F
Thinner De-ionized water De-ionized water